Johnson Matthey will license
to Kyocera its Plastic Land Grid Array (PLGA) technology, where
it has developed leadership in packages for the latest generation
of microprocessors. Kyocera will license to JM its technology
for future generations of plastic laminate packages for semiconductors.
The application of Kyocera's technology is referred to as C4,
flip chip or direct chip attach.
JM's PLGA product was certified
at its new plant in Chippewa Falls in December 1996. Since then
production quantities have been shipped from this facility in
steadily growing amounts. Good progress is being made in achieving
the goal of full capacity production towards the end of JM's
financial year. This will involve some 1.5 million units per
month.
Johnson Matthey is a world leader
in advanced materials technology and a leading supplier of materials
to the semiconductor and microelectronics industries. It entered
the multi-layer printed circuit board market with the successful
acquisition of Advance Circuits Inc in 1995. Since then, Johnson
Matthey has developed leading PLGA technology and has converted
the recently acquired printed circuit board business of Cray
Research Inc into a state of the art facility for these products.
The agreement with Kyocera will help ensure that JM's leading
position in plastic laminate technology will be extended well
into the future.
Kyoto, Japan - based Kyocera,
the world's leading manufacturer of ceramic packages for microprocessors,
is now devoting considerable resources to developing new plastic
laminate packaging technology. Kyocera is one of Japan's largest
suppliers of components and finished products to the electronics
industry.
In commenting on these agreements
Chris Clark, Johnson Matthey's Chief Operating Officer, said:
"These agreements with Kyocera
underline the quality of JM's electronic materials business in
general and our rapidly growing PLGA business in particular."
Dr Michael Cleare, Managing Director,
Electronic Materials, added:
"By signing these agreements
we are ensuring that JM is in possession of the next generation
of plastic packaging technology for microprocessors at an early
stage of its development."